Prediction of surface temperature rise of ultrasonic diagnostic array transducers

被引:5
|
作者
Ohm, Won-Suk [1 ,2 ]
Kim, Jeong Hwan [1 ]
Kim, Eun Chul [1 ]
机构
[1] Medison Co Ltd, Probe R&D Ctr, Seoul 135280, South Korea
[2] NSERC Canadian Govt Lab, Natl Res Council, Inst Natl Measurement Stand, Acooust Stand Program, Ottawa, ON, Canada
关键词
D O I
10.1109/TUFFC.2008.622
中图分类号
O42 [声学];
学科分类号
070206 ; 082403 ;
摘要
Temperature rise at the surface of an ultrasound transducer used for diagnostic imaging is an important factor in patient safety and regulatory compliance. This paper presents a semianalytical model that is derived from first principles of heat transfer and is simple enough to be implemented in a commercial ultrasound scanner for real-time forecasting of transducer surface temperature. For modeling purposes, one-dimensional array transducers radiating into still air are considered. Promising experimental verification data are shown and practical implementation benefits of the model for thermal design and management of ultrasonic array transducers are discussed. In particular, the reduction in the amount of thermal characterization data required, compared to empirical models, shows promise.
引用
收藏
页码:125 / 138
页数:14
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