Single wafer wet cleaning based on short cycle time, ambient temperature and a small amount of chemical

For recent further requirements, a short cycle time, reductions of oxide loss and chemical consumption are required for wet cleaning. We found that a two-step process, SC-1 10 sec --> HF/HCI 10 sec, could improve metal removal efficiency in comparison with one-step processes. In order to improve particle removal efficiency., the two-fluid spray, Nanospray(TM), was employed on the first SC-1 step of the two-step process. In addition, the Nanospray(TM) also achieved low chemical consumption. In this study, we have demonstrated that the two-step cleaning process has the features of a short cycle time, small oxide loss and low chemical consumption for single wafer cleaning.