Thermal Cycling induced Load on Copper-Ribbons in Crystalline Photovoltaic Modules

被引：5

作者：

Meier, R. ^{[1
]}

Kraemer, F. ^{[1
]}

Wiese, S. ^{[1
]}

Wolter, K. -J. ^{[2
]}

Bagdahn, J. ^{[1
]}

机构：

[1] Fraunhofer Ctr Silicon Photovolta CSP, Walter Huelse Str 1, D-06120 Halle, Saale, Germany

[2] Tech Univ Dresden, Elect Packaging Lab, D-01069 Dresden, Germany

来源：

RELIABILITY OF PHOTOVOLTAIC CELLS, MODULES, COMPONENTS, AND SYSTEMS III | 2010年 / 7773卷

关键词：

Ribbon; FEM; Reliability; thermo-mechanical; thermal cycling test;

D O I：

10.1117/12.861350

中图分类号：

TE [石油、天然气工业]; TK [能源与动力工程];

学科分类号：

0807 ; 0820 ;

摘要：

Solar module lifetime is limited by the fatigue behavior of its cell interconnectors: the copper-ribbons. Every change in temperature induces thermo-mechanical stresses in the module components due to their thermo-mechanical mismatch. The purpose of this work is to quantify this load on the copper-ribbons between the individual cells of a cell string during a thermal cycling test by measuring cell displacement using digital image correlation and to compare the results to finite element analysis (FEM). Furthermore with help of FEM the influences of different materials were investigated, allowing material and layout optimizations with respect to copper-ribbon loading.

引用

页数：8

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