Cutting temperature and its effect to sub-surface damage in diamond turning

被引:0
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作者
Horio, K [1 ]
Kasai, T [1 ]
Sekiguchi, K [1 ]
机构
[1] Saitama Univ, Urawa, Saitama 338, Japan
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T [工业技术];
学科分类号
08 ;
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页码:199 / 202
页数:4
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