Influence of nanosilica and methyl methacrylate-butadiene-styrene core-shell rubber particles on the physical-mechanical properties and cure kinetics of diglycidyl ether of bisphenol-A-based epoxy resin

被引:21
|
作者
Mousavi, Sayed Rasoul [1 ]
Amraei, Iraj Amiri [1 ]
机构
[1] Composite Res Ctr, POB 1469695876, Tehran, Iran
关键词
Differential scanning calorimetry (DSC); cure kinetics; mechanical properties; DGEBA epoxy resin; dicyandiamide; nanosilica; MBS core-shell rubber particles; FRACTURE-TOUGHNESS; REINFORCED EPOXY; DICYANDIAMIDE; VISCOSITY; BEHAVIOR; PREPREG; SYSTEMS; MODE; HEAT; CTBN;
D O I
10.1177/0954008315600228
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
The influence of nanosilica and methyl methacrylate-butadiene-styrene (MBS) core-shell rubber particles on the physical-mechanical properties and cure kinetics of diglycidyl ether of bisphenol-A-based epoxy resin (EP)/dicyandiamide were investigated using tensile test, dynamic mechanical thermal analysis, and differential scanning calorimetry under dynamic conditions. The results indicated that inclusion of core-shell rubber particles and nanosilica (NS) into EP increased cure onset, peak and end temperatures of the modified EP relative to the neat EP. Studies on cure kinetics based on Kissinger and Ozawa method also showed that there was decrease in the values of E-a and A. Also, the order of the overall reaction was found to be approximately equal to 2. Differential scanning calorimetry graphs obtained by the experimental data had good agreement with that calculated theoretically. Young's modulus and tensile strength of the EP increase with the inclusion of NS; however, the corresponding values decrease when the core-shell particles are included in the EP. The tensile strength and the modulus of the EP modified with NS and core-shell particles also decreased relative to the neat EP. On the other hand, by adding core-shell particles and NS, the glass transition temperature of the samples remained approximately constant as obtained from dynamic mechanical thermal analysis.
引用
收藏
页码:809 / 819
页数:11
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