Ultrathin Ta2O5 film capacitor with Ru bottom electrode

被引:39
|
作者
Aoyama, T [1 ]
Yamazaki, S [1 ]
Imai, K [1 ]
机构
[1] Toshiba Corp, Microelect Engn Lab, USLI Proc Engn Lab, Yokohama, Kanagawa 2358522, Japan
关键词
D O I
10.1149/1.1838745
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
The characteristics of the ultrathin Ta2O5 film capacitors with Ru bottom electrodes have been investigated. Ru films are deposited on n(+)-Si by sputtering in 10% O-2/Ar ambient, for the bottom electrode, and Ta2O5 films are deposited by chemical vapor deposition using Ta(OC2H5)(5) and O-2. By O-2 plasma treatment at 400 degrees C after N-2 thermal treatment at 700 degrees C, excellent properties, are obtained such that the effective SiO2 film thickness is 0.68 nm for 6 nm thick Ta2O5 film and the leakage current is less than 1 x 10(-8) A/cm(2) between the range of -2.1 and +1.8 V. The Ta2O5 film with a Ru bottom electrode is one of the most suitable structures for Gbit dynamic random access memory capacitors.
引用
收藏
页码:2961 / 2964
页数:4
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