Application of data fusion technology in nondestructive testing for printed circuit board

被引:0
|
作者
Wang, GF [1 ]
Wu, GQ [1 ]
Xu, HG [1 ]
Pang, Y [1 ]
机构
[1] Ordnance Engn Coll, Ordnance Technol Inst, Shijiazhuang 050000, Peoples R China
关键词
D O I
暂无
中图分类号
TH7 [仪器、仪表];
学科分类号
0804 ; 080401 ; 081102 ;
摘要
The infrared thermal imaging technology is one of effectual method which can enhanced the ability of circuit board test system. In the basis of circuit board fault test analysis, this paper has introduced the constitute structure of circuit board Nondestructive test system, an fault diagnosis method based on data fusion is presented, and it is applied effectually to circuit board Nondestructive test system, the diagnosis ability of system is improved.
引用
收藏
页码:4909 / 4912
页数:4
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