Effects of the Cooling Rate on the Solidification Microstructure of Cu-Ni Alloy

被引:0
|
作者
Yuan, Jiawei [1 ]
Pang, Yuhua [1 ]
Hu, Yanglei [1 ]
Sun, Qi [1 ]
Liu, Dong [2 ]
Yang, Yanhui [2 ]
机构
[1] Xian Univ Architecture & Technol, Sch Met Engn, Xian 710055, Peoples R China
[2] Northwestern Polytech Univ, Xian 710072, Peoples R China
来源
关键词
Cu-Ni alloy; Numerical simulation; Cooling rate; Solidification microstructure; MECHANICAL-PROPERTIES;
D O I
10.4028/www.scientific.net/MSF.658.444
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The effect of cooling rate on the solidification microstructure of Cu-Ni alloy is investigated here. The Cu-Ni alloy was prepared in a main frequency furnace with three different molds made of silica sand, graphite, and low carbon steel in the foundry. The simulation software of diathermanous-flowing-stress coupling PROCAST is used to simulate the Cu-Ni alloy solidification process about temperature field with the three molds. The microstructures of the alloys have been studied through the optical microscopy (OM), the scanning electron microscopy (SEM), together with the energy dispersive spectroscopy (EDS). The results show that the grain average size and the primary and secondary dendrite arm space were obviously reduced with the increase of cooling rate. The dendrite and interdendrite element segregation also decreases with increasing cooling rate.
引用
收藏
页码:444 / +
页数:2
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