Mechanical Properties of Rolled Copper Foils in Cryogenic and Room-Temperature Environments

被引:5
|
作者
Yu, Hailiang [1 ,2 ]
Zhao, Xiangshuai [1 ,2 ]
Kong, Charlie [3 ]
机构
[1] Cent South Univ, Light Alloy Res Inst, Changsha 410083, Peoples R China
[2] Cent South Univ, State Key Lab High Performance Complex Mfg, Changsha 410083, Peoples R China
[3] Univ New South Wales, Mark Wainwright Analyt Ctr, Sydney, NSW 2052, Australia
基金
中国国家自然科学基金;
关键词
copper foils; cryogenic environments; dislocations; material characterizations; mechanical properties; MICROSTRUCTURES; STRENGTH; ALLOY;
D O I
10.1002/adem.202100830
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The mechanical properties of high-purity asymmetric rolled copper foils under cryogenic-temperature and room-temperature conditions are studied. The experimental results show that the ultimate tensile stress of the foils increases to a certain value (rolling reduction ratio approximate to 80%) and then decreases with a decrease in thickness when the tensile tests are carried out in the room-temperature environment, which monotonically increases with the decrease in the foil thickness when the tensile tests are carried out in a cryogenic environment. The effect on the tensile strength of the copper foil is related to the intrinsic microstructural parameters, such as the dislocation density, grain boundary spacing, and dislocation source. The tensile test results at room and cryogenic temperatures reveal that the elongation decreases with an increase in the rolling reduction ratio. Interestingly, the copper foils of the tensile test at the cryogenic temperature exhibit better elongation than that at the room temperature.
引用
收藏
页数:9
相关论文
共 50 条
  • [1] Mechanical properties of rolled and aged AA6061 sheets at room-temperature and cryogenic environments
    Liu, Yue
    Zhao, Xiangshuai
    Li, Jing
    Bhatta, Laxman
    Luo, Kaiguang
    Kong, Charlie
    Yu, Hailiang
    JOURNAL OF ALLOYS AND COMPOUNDS, 2021, 860
  • [2] On the room-temperature annealing of cryogenically rolled copper
    Konkova, T.
    Mironov, S.
    Korznikov, A.
    Semiatin, S. L.
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2011, 528 (24): : 7432 - 7443
  • [3] Unveiling the room-temperature softening phenomenon and texture evolution in room-temperature- and cryogenic-rolled ETP copper
    Gupta, Aman
    Yoo, Tae-Hyeon
    Kaushik, Lalit
    Lee, Jin Woo
    Kim, Young-Kil
    Choi, Shi-Hoon
    INTERNATIONAL JOURNAL OF PLASTICITY, 2022, 156
  • [4] Room-temperature mechanical properties of cold-rolled thin foils of binary, stoichiometric Ni3Al
    Demura, M
    Kishida, K
    Suga, Y
    Hirano, T
    METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 2002, 33 (08): : 2607 - 2613
  • [5] Room-temperature mechanical properties of cold-rolled thin foils of binary, stoichiometric Ni3Al
    Masahiko Demura
    Kyosuke Kishida
    Toshiyuki Hirano
    Yozo Suga
    Metallurgical and Materials Transactions A, 2002, 33 : 2607 - 2613
  • [6] Room-temperature instability of the structure of copper deformed at a cryogenic temperature
    Konkova T.N.
    Mironov S.Y.
    Korznikov A.V.
    Russian Metallurgy (Metally), 2011, 2011 (7) : 689 - 698
  • [7] The kinetics and mechanism of room-temperature microstructural evolution in electroplated copper foils
    Yin, K. B.
    Xia, Y. D.
    Chan, C. Y.
    Zhang, W. Q.
    Wang, Q. J.
    Zhao, X. N.
    Li, A. D.
    Liu, Z. G.
    Bayes, M. W.
    Yee, K. W.
    SCRIPTA MATERIALIA, 2008, 58 (01) : 65 - 68
  • [8] Room-temperature soldering with nanostructured foils
    Wang, J
    Besnoin, E
    Duckham, A
    Spey, SJ
    Reiss, ME
    Knio, OM
    Powers, M
    Whitener, M
    Weihs, TP
    APPLIED PHYSICS LETTERS, 2003, 83 (19) : 3987 - 3989
  • [9] ROOM-TEMPERATURE SLIP IN SILICON FOILS
    PUTTICK, KE
    SHAHID, MA
    PHYSICA STATUS SOLIDI A-APPLIED RESEARCH, 1980, 59 (01): : K5 - &
  • [10] Mechanical properties of room temperature rolled MgLiAlZn alloy
    Wang, Jian-Yih
    JOURNAL OF ALLOYS AND COMPOUNDS, 2009, 485 (1-2) : 241 - 244