Thermal stability of silver thin films on zirconia substrates

被引:61
|
作者
Simrick, N. J. [1 ]
Kilner, J. A. [1 ]
Atkinson, A. [1 ]
机构
[1] Univ London Imperial Coll Sci Technol & Med, Dept Mat, London SW7 2BP, England
基金
英国工程与自然科学研究理事会;
关键词
Silver; Void; Dewetting; Surface energy; Interfaces; Agglomeration; ABNORMAL GRAIN-GROWTH; NI PATTERN ANODES; PLATINUM-ELECTRODES; SELF-DIFFUSION; AG; EXPANSION; STATE; CU;
D O I
10.1016/j.tsf.2011.11.048
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The thermal stability of silver thin films between 100 nm and 820 nm thick deposited onto single crystal yttria-stabilised zirconia (YSZ) substrates by evaporation was investigated by annealing the films between 250 degrees C and 550 degrees C for different durations. Films approximately 100 nm thick were thermally unstable at temperatures as low as 250 degrees C. A dewetting process occurred in which grain boundaries ruptured, to uncover the substrate and reduce the overall energy of the system, by a combination of grain boundary grooving at the outer surface and void growth at the Ag-YSZ interface. The surface self diffusion coefficient of Ag was determined from the kinetics of the process to be 2.6 +/- 03 x 10(-5) cm(2)s(-1) at 500 degrees C. The resulting silver morphology ranged from 'self-organised' interconnected silver network structures to completely isolated silver islands. A structure predominance map of the rearrangement process is presented. (C) 2011 Elsevier B.V. All rights reserved.
引用
收藏
页码:2855 / 2867
页数:13
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