Magnet conductor development using Bi-2223 high temperature superconducting wire

Cabling and filament stacking technology has been developed for Pi-based HTS composite wire. Concentric round cabling as well as Rutherford cabling has been proven in >100m lengths. For Bi-2223 precursor composite wire, post-cabling deformation is required to achieve high transport engineering current density (J(e)), and results have reached 5500 A/cm(2) at 77K and self-field. Stacked conductors are roll deformed prior to multifilament consolidation and multifilament stacks have reached 5600 A/cm(2) at 77K and self field. These HTS composites have great potential for providing high Ic, Je, and reducing fabrication cost. An overview of this new processing route will be presented.