Study of Wettability and Solderability of SiC Ceramics with Ni by Use of Sn-Sb-Ti Solder by Heating with Electron Beam in Vacuum

被引：0

作者：

Kolenak, Roman ^{[1
]}

Kostolny, Igor ^{[1
]}

Drapala, Jaromir ^{[2
]}

Urminsky, Jan ^{[1
]}

Pluhar, Alexej ^{[1
]}

Babincova, Paulina ^{[1
]}

Drimal, Daniel ^{[3
]}

机构：

[1] Slovak Univ Technol Bratislava, Fac Mat Sci & Technol Trnava, Jana Bottu C 2781-25, Trnava 91724, Slovakia

[2] Tech Univ Ostrava, FMT Fac Mat Sci & Technol, 17 Listopadu 15, Ostrava 70833, Czech Republic

[3] First Welding Co Inc, Kopcianska 14, Bratislava 85101, Slovakia

来源：

MATERIALS | 2022年 / 15卷 / 15期

关键词：

active solder; solderability; wettability; electron beam; SiC ceramics; MICROSTRUCTURE; TEMPERATURE; EVOLUTION; BEHAVIOR; METALS; SYSTEM; JOINTS; AL2O3; ALLOY; VPS;

D O I：

10.3390/ma15155301

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

The aim of this research was to study the wettability and solderability of SiC ceramics by the use of an active solder of the type Sn5Sb3Ti in a vacuum by electron beam heating. This solder exerts a narrow melting interval, and only one thermal effect, a peritectic reaction, was observed. The liquidus temperature of the solder is approximately 243 degrees C. The solder consists of a tin matrix where the Ti-6(Sb,Sn)(5) and TiSbSn phases are precipitated. The solder wettability on a SiC substrate decreases with decreasing soldering temperature. The best wetting angle of 33 degrees was obtained in a vacuum at the temperature of 950 degrees C. The bond between the SiC ceramics and the solder was formed due to the interaction of Ti and Ni with silicon contained in the SiC ceramics. The formation of new TiSi2 and Ti3Ni5Si6 phases, which form the reaction layer and thus ensure the bond formation, was observed. The bond with Ni is formed due to the solubility of Ni in the tin solder. Two phases, namely the Ni3Sn2 and Ni3Sn phases, were identified in the transition zone of the Ni/Sn5Sb3Ti joint. The highest shear strength, around 40 MPa, was attained at the soldering temperature of 850 degrees C.

引用

页数：21