Polishing of Tungsten Carbide by Combination of Anodizing and Silica Slurry Polishing

被引:9
|
作者
Deng, Hui [1 ]
Zhang, Xinquan [2 ]
Liu, Kui [2 ]
Yamamura, Kazuya [3 ]
Sato, Hirotaka [4 ]
机构
[1] Southern Univ Sci & Technol, Dept Mech & Energy Engn, Shenzhen 518055, Guangdong, Peoples R China
[2] Singapore Inst Mfg Technol, Singapore 637662, Singapore
[3] Osaka Univ, Grad Sch Engn, Res Ctr Ultra Precis Sci & Technol, Suita, Osaka 5650871, Japan
[4] Nanyang Technol Univ, Sch Mech & Aerosp Engn, Singapore, Singapore
关键词
DIAMOND; SURFACE; MECHANISM; XPS;
D O I
10.1149/2.1931712jes
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
Sintered tungsten carbide (WC) is widely used in precision molding of optical glass lenses, and is considered as a critical mold material for optical industry, due to its high hot hardness and low thermal expansion ratio. However, WC is also a well-known difficult-to-polish material owing to its high hardness and strong chemical inertness. In an effort to realize the high-quality and highly efficient polishing of WC, a two-step polishing process combining anodizing and soft abrasive polishing was developed. Experimental studies of the anodizing step and the slurry polishing step were conducted. Anodizing has been found to be able to quickly soften WC and realized a drastic decrease of its surface hardness from 22.1 GPa to below 2.0 GPa, which allows us to polish the substrate surface using soft silica abrasives. In the polishing step using silica slurry, the oxide layer was removed and it has been revealed that the surface quality of polished WC was greatly affected by the duration of anodizing and the type of polishing pad. A scratch-free, pit-free and smooth WC surface can be obtained by combination of 10 min of anodizing and 30 min of silica slurry polishing using a suede type polishing pad. This research offers a new method for achieving high-quality finishing of WC with high efficiency. (C) 2017 The Electrochemical Society. All rights reserved.
引用
收藏
页码:E352 / E359
页数:8
相关论文
共 50 条
  • [1] Improvement of dispersion stability and polishing performance of chemical mechanical polishing slurry for cemented carbide inserts
    Qin, Changjiang
    Chen, Wanli
    Zhang, Chi
    Hu, Zihua
    Mao, Meijiao
    Jiang, Shengqiang
    Chen, Xiaogao
    JOURNAL OF DISPERSION SCIENCE AND TECHNOLOGY, 2025, 46 (02) : 297 - 307
  • [2] LAPPING AND POLISHING OF TUNGSTEN CARBIDE DRAWING DIES.
    Swan, R.J.
    Wire Industry, 1980, 47 (564): : 1023 - 1024
  • [3] Chemical mechanical polishing of copper using silica slurry
    Kondo, S
    Sakuma, N
    Homma, Y
    Ohashi, N
    PROCEEDINGS OF THE SYMPOSIA ON ELECTROCHEMICAL PROCESSING IN ULSI FABRICATION I AND INTERCONNECT AND CONTACT METALLIZATION: MATERIALS, PROCESSES, AND RELIABILITY, 1999, 98 (06): : 195 - 205
  • [4] A liposome-containing slurry for tungsten chemical mechanical polishing
    Zhao, Junzi
    Wu, Ping
    Brancewicz, Chris
    Li, Yuzhuo
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2007, 154 (03) : H225 - H230
  • [5] Application of tungsten slurry for copper-chemical mechanical polishing
    Seo, YJ
    Lee, WS
    MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, 2005, 118 (1-3): : 285 - 288
  • [6] Effect of oxidants and additives on the polishing performance in tungsten CMP slurry
    Lee, Jae Seok
    Choi, Beom Suk
    ANALYTICAL SCIENCE AND TECHNOLOGY, 2006, 19 (05): : 394 - 399
  • [7] Effect of graphene additions on polishing of silicon carbide wafer with functional PU/silica particles in CMP slurry
    Liu, Hsien-Kuang
    Chen, Chao-Chang A.
    Chen, Chun-Jen
    FUNCTIONAL MATERIALS LETTERS, 2019, 12 (05)
  • [8] Micro Polishing of Tungsten Carbide using Magnetostrictive Vibrating Polisher
    Guo, Jiang
    Suzuki, Hirofumi
    Morita, Shin-ya
    Yamagata, Yutaka
    Higuchi, Toshiro
    PROCEEDINGS OF PRECISION ENGINEERING AND NANOTECHNOLOGY (ASPEN2011), 2012, 516 : 569 - +
  • [9] Fumed silica slurry stabilizing methods for chemical mechanical polishing
    Haba, S., 1600, Japan Society of Applied Physics (42):
  • [10] Material removal by slurry erosion in the robot polishing of optics by polishing slurry nozzles
    Schneckenburger, Max
    Almeida, Rui
    Hoefler, Sven
    Boerret, Rainer
    WEAR, 2022, 494-495