An efficient online time-temperature-dependent creep-fatigue rainflow counting algorithm

被引:41
|
作者
Samavatian, Vahid [1 ,2 ]
Iman-Eini, Hossein [1 ]
Avenas, Yvan [2 ]
机构
[1] Univ Tehran, Sch Elect & Comp Engn, Coll Engn, Tehran, Iran
[2] Univ Grenoble Alpes, CNRS, Grenoble INP, Inst Engn,G2Elab, F-38000 Grenoble, France
关键词
Creep failure mechanism; Cycle counting; Rainflow algorithm; Reliability assessment; POWER DEVICES; RELIABILITY; LIFE; LOAD; PREDICTION; JOINTS; DAMAGE;
D O I
10.1016/j.ijfatigue.2018.06.037
中图分类号
TH [机械、仪表工业];
学科分类号
0802 ;
摘要
Reliability assessment of the materials in real applications in which the materials are exposed to the numerous and complicated time-domain cycles has become one of the most important issues facing all reliability engineers. From offline to online useful lifetime estimations of the material, cycle counting such as Rainflow is paramount of importance. Rainflow algorithm plays the role of transferring complicated time domain cycles to the sorted set of data. This set of data applies to the lifetime model of the material and make the researchers evaluate useful life time of the materials. In this paper, a new online time-temperature-dependent creep-fatigue Rainflow counting algorithm has been proposed. In this new algorithm, online counting of half cycles, time-temperature-dependent mean temperature and creep failure mechanism have been all considered leading to the much more accurate cycle counting and reliability assessment, consequently. This study presents that consideration of the time temperature-dependent mean temperature and creep failure mechanism can thoroughly impress the reliability assessment in the materials exposed to the temperature cycling. This feature has been validated by employing a set of experimental data of a solder joint, namely the constants of Coffin-Manson-Arrhenius and MonkmanGrant, in a power semiconductor. While the solder joint has been exposed to the specified cycles, the results show that the useful lifetime of the solder joint in the power semiconductor can be estimated with 10% increase in accuracy. The results reveal the importance of the creep failure mechanism and the time-temperature-dependent mean temperature on the reliability assessment.
引用
收藏
页码:284 / 292
页数:9
相关论文
共 50 条
  • [1] High temperature creep-fatigue design
    A. -A. F. Tavassoli
    B. Fournier
    M. Sauzay
    [J]. Transactions of the Indian Institute of Metals, 2010, 63 : 235 - 244
  • [2] High temperature creep-fatigue design
    Tavassoli, A. -A. F.
    Fournier, B.
    Sauzay, M.
    [J]. TRANSACTIONS OF THE INDIAN INSTITUTE OF METALS, 2010, 63 (2-3): : 235 - 244
  • [3] Converter Lifetime Modeling Based on Online Rainflow Counting Algorithm
    Chen, Zhiwen
    Gao, Fei
    Yang, Chao
    Peng, Tao
    Zhou, Lu
    Yang, Chunhua
    [J]. 2019 IEEE 28TH INTERNATIONAL SYMPOSIUM ON INDUSTRIAL ELECTRONICS (ISIE), 2019, : 1743 - 1748
  • [4] High temperature creep, fatigue and creep-fatigue interaction in engineering materials
    Yokobori, T
    Yokobori, AT
    [J]. INTERNATIONAL JOURNAL OF PRESSURE VESSELS AND PIPING, 2001, 78 (11-12) : 903 - 908
  • [5] An Efficient Implementation of the Rainflow Counting Algorithm for Life Consumption Estimation
    Musallam, Mahera
    Johnson, C. Mark
    [J]. IEEE TRANSACTIONS ON RELIABILITY, 2012, 61 (04) : 978 - 986
  • [6] High temperature creep-fatigue in stainless steel
    Rees, DWA
    [J]. ADVANCES IN MECHANICAL BEHAVIOUR, PLASTICITY AND DAMAGE, VOLS 1 AND 2, PROCEEDINGS, 2000, : 1315 - 1320
  • [7] High temperature creep-fatigue behaviour of nickel
    Sklenicka, V
    Kucharová, K
    Lukás, P
    [J]. FATIGUE '99: PROCEEDINGS OF THE SEVENTH INTERNATIONAL FATIGUE CONGRESS, VOLS 1-4, 1999, : 2105 - 2110
  • [8] FATIGUE AND CREEP-FATIGUE TESTING OF BELLOWS AT ELEVATED-TEMPERATURE
    YAMAMOTO, S
    ISOBE, K
    OHTE, S
    TANAKA, N
    OZAKI, S
    KIMURA, K
    [J]. JOURNAL OF PRESSURE VESSEL TECHNOLOGY-TRANSACTIONS OF THE ASME, 1988, 110 (03): : 301 - 307
  • [9] Influence of hold time on creep-fatigue life and metallurgical degradation at high temperature
    Lim, BS
    Kim, BJ
    [J]. FRACTURE AND STRENGTH OF SOLIDS VI, PTS 1 AND 2, 2006, 306-308 : 1013 - 1018
  • [10] On time-temperature-dependent viscoelastic behavior of an amorphous polyimide
    Crochon, Thibaut
    Li, Chun
    Levesque, Martin
    [J]. MECHANICS OF TIME-DEPENDENT MATERIALS, 2015, 19 (03) : 305 - 324