Thermal and mechanical properties of copper/photopolymer composite

Purpose - The purpose of this study is to increase the thermal and mechanical properties of the photopolymer by filling with the copper powder for the application of rapid tooling. Design/methodology/approach - In this study, the photopolymer is filled with the different loading of copper powder for investigating the thermal and mechanical properties of the copper/photopolymer composite. The thermal properties of the copper/photopolymer composite are characterized with the degradation temperature and with the thermal conductivity. The mechanical properties of copper/photopolymer composite are performed with the tensile strength and hardness testing. Moreover, the copper/photopolymer composite is imaged by using a scanning electron microscopic with energy dispersive spectroscopy. Findings - The tensile strength of the copper/photopolymer composite is increased over 45 per cent at 20 phr copper loading. The hardness of the photopolymer has a negative correlation with the increasing copper loading and is decreased about 28.5 per cent at 100 phr copper loading. The degradation temperature of the copper/photopolymer composite is increased about 7.2 per cent at 70 phr copper loading. The thermal conductivity of the copper/photopolymer composite is increased over 65 per cent at 100 phr copper loading. Originality/value - The photopolymer used in rapid prototyping system is generally fragile and has poor thermal properties. This study improves the thermal and mechanical properties of the photopolymer with the copper filling which has been never investigated in the field of rapid prototyping applications.