Adhesive Bonding of Polymeric Microfluidic Devices

被引：3
|
作者：
Goh, C. S. [1 ]
Tan, S. C. [1 ]
May, K. T. [1 ]
Chan, C. Z. [1 ]
Ng, S. H. [1 ]
机构：
[1] Singapore Inst Mfg Technol, Singapore 638075, Singapore
来源：
2009 11TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2009) | 2009年
关键词：
D O I：
10.1109/EPTC.2009.5416452
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper investigates the use of adhesive bonding on polymeric microfluidic devices. Both pressure sensitive and UV curable adhesives have been studied. Characterization tests conducted include flow, pressure and 180 peel tests. All the five adhesives are able to pass the flow and pressure tests. Pressure sensitive adhesives generally perform better than UV curable adhesives in the peel tests due to the different substrates used. With careful application of the adhesives, UV curable adhesives show less sagging into the microfluidic channels as compared to pressure sensitive adhesives.
引用
收藏
页码：737 / 740
页数：4
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