Analytical and Finite Element Analysis of Thermal Stresses in TiN Coatings

被引：6
|
作者：
Hernandez, M. J. [1 ]
White, S. E. [1 ]
Chessa, J. F. [1 ]
Ramana, C. V. [1 ]
机构：
[1] Univ Texas El Paso, Dept Mech Engn, El Paso, TX 79968 USA
来源：
MECHANICS OF ADVANCED MATERIALS AND STRUCTURES | 2015年 / 22卷 / 12期
关键词：
TiN coatings; thermal stress; finite element analysis axisymmetric geometry; interfacial mechanics; NITRIDE; FILMS;
D O I：
10.1080/15376494.2012.707304
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The thermal residual stress and associated effects in TiN coatings with planar and nonplanar surface roughness on silicon (100) substrates were analyzed using both analytical and finite element (FE) modeling. The effect of growth temperature (T-s), thickness, and the modulus of elasticity on the stress evolution in TiN coatings is reported. The results indicate that the variable thermal stress in the TiN coatings is due to the existence of both positive and negative temperature gradients and thus the resultant existence of disparity of the coefficient of thermal expansion between the substrate and the coating.
引用
收藏
页码：1024 / 1030
页数：7
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