On 2-D transmission line modeling of power and ground planes in multilayer structures

被引：0
|
作者：
Tarvainen, T [1 ]
Kolehmainen, J [1 ]
机构：
[1] Esju Oy, Oulu 90630, Finland
来源：
ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING | 2000年
关键词：
D O I：
10.1109/EPEP.2000.895501
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Multilayer RF structures including power and ground planes can form complicated resonators. This paper discusses 2-D transmission line modeling of these structures. Modeled results are verified with measurements.
引用
收藏
页码：95 / 98
页数：4
相关论文
共 50 条
  • [1] A Combined 1D and 2D DGTD Method for Modeling Multilayer Power-Ground Planes with Narrow Slots
    Lee, Hui Min
    Gao, Si-Ping
    Liu, En-Xiao
    [J]. 2018 JOINT IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY AND 2018 IEEE ASIA-PACIFIC SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (EMC/APEMC), 2018, : 107 - 108
  • [2] Modeling of Arbitrary Power-Ground Planes with Slot by Using Integral Equation and Transmission Line Method
    Zou, Guo-Ping
    Li, Er-Ping
    Wei, Xing-Chang
    Cui, Xiang
    Luo, Guang-xiao
    [J]. APMC: 2009 ASIA PACIFIC MICROWAVE CONFERENCE, VOLS 1-5, 2009, : 2428 - +
  • [3] Modeling noise coupling between package and PCB power/ground planes with an efficient 2-D FDTD/lumped element method
    Wang, Ting-Kuang
    Chen, Sin-Ting
    Tsai, Chi-Wei
    Wu, Sung-Mao
    Drewniak, James L.
    Wu, Tzong-Lin
    [J]. IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2007, 30 (04): : 864 - 871
  • [4] An interactive 2-D power-line modeling and simulation tool
    Hull, David
    Adelman, Ross
    [J]. ACTIVE AND PASSIVE SIGNATURES III, 2012, 8382
  • [5] Multiconductor Transmission Line Modeling of Crosstalk Between Cables in the Presence of Composite Ground Planes
    Rotgerink, Jesper Lansink
    Serra, Ramiro
    Leferink, Frank
    [J]. IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 2021, 63 (04) : 1231 - 1239
  • [6] An efficient and flexible modeling for power/ground planes
    Wu, Kai-Bin
    Shiue, Guang-Hwa
    Guo, Wei-Da
    Lin, Chien-Min
    Wu, Ruey-Beei
    [J]. ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 2006, : 83 - +
  • [7] Modeling Multilayer Power/Ground Planes in Printed Circuit Boards and Electronic Packages Using Microwave Networks
    Zhang, W. Z.
    Liu, E. X.
    Li, E. P.
    [J]. PROCEEDINGS OF THE 2012 IEEE 14TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2012, : 637 - 640
  • [8] The transmission line modeling (TLM) method as a new iterative technique in nonlinear 2-D magnetostatics
    Lobry, J
    Trecat, J
    Broche, C
    [J]. IEEE TRANSACTIONS ON MAGNETICS, 1996, 32 (02) : 559 - 566
  • [9] Influence of finite ground planes on the transmission line current distribution
    Sabath, F
    Bucker, M
    Oing, S
    [J]. IEEE TRANSACTIONS ON MAGNETICS, 1996, 32 (03) : 1501 - 1504
  • [10] Efficient Modeling of Power/Ground Planes Using Delay-Extraction-Based Transmission Lines
    Roy, Sourajeet
    Dounavis, Anestis
    [J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2011, 1 (05): : 761 - 771
12345