Low-cost fabrication of optical subassemblies

被引:2
|
作者
Cohen, MS [1 ]
Johnson, GW [1 ]
Trewhella, JM [1 ]
Lacey, DL [1 ]
Oprysko, MM [1 ]
Karst, DL [1 ]
DeFoster, SM [1 ]
Hogan, WK [1 ]
Peterson, MD [1 ]
Weirick, JA [1 ]
机构
[1] IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598
关键词
D O I
10.1109/ECTC.1996.550818
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The optical subassembly is a major contributor to the cost of a fiberoptic computer data link. A technology for low-cost fabrication of optical subassemblies is described, with emphasis on the transmitter subassembly. A factor of three cost reduction is achieved by limiting the parts count to only three: a laser or receiver chip packaged in a TO-can, a plastic housing, and a plastic aspheric lens; and by employment of a fast, automated active-alignment and subsequent fixing technique. Key enabling features include the use of precision injection molding of specially chosen plastics, an aspheric lens design which permits wide positional variations in the axial direction, and curing of a fast setting epoxy through the use of RF power. A tool was constructed which produced subassemblies at high yield having satisfactory performance.
引用
收藏
页码:1093 / 1100
页数:4
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