Experimental investigation of micro wire electrochemical discharge machining by using a rotating helical tool

被引:30
|
作者
Liu, Yong [1 ,2 ]
Wei, Zhiyuan [1 ]
Wang, Mingyu [2 ]
Zhang, Jianhua [2 ]
机构
[1] Shandong Univ, Associated Engn Res Ctr Mech & Mechatron Equipmen, Weihai City 264209, Peoples R China
[2] Shandong Univ, Key Lab High Efficiency & Clean Mech Manufacture, Minist Educ China, Sch Mech Engn, Jinan 250061, Shandong, Peoples R China
基金
中国国家自然科学基金; 中国博士后科学基金;
关键词
Wire electrochemical discharge machining; Quartz glass; Rotating helical tool; High aspect ratio micro-structures; Closed structure; GLASS; PERFORMANCE;
D O I
10.1016/j.jmapro.2017.08.004
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The wire electrochemical discharge machining (WECDM) process is an effective way to machine high aspect ratio of micro-structures on non-conductive, hard, and brittle materials like quartz glass and ceramics. In this paper, the newly developed micro WECDM by using a rotary helical tool is proposed. Many experiments are conducted to investigate the machining localization of the WECDM with a rotating helical tool. The present study discusses the effects of machining parameters like applied voltage, frequency, duty factor, spindle speed, and feed rate on the side gap during the slicing of glass workpiece by using the developed WECDM setup. Experimental results demonstrates that the side gap rises with the increase in applied voltage and duty factor and reduces with the rise in frequency, spindle speed, and feed rate. Series of kerfs with 138 mu m width are fabricated successfully by the optimized parameters. The complex closed structure, the high aspect ratio kerf, and the pattern structure with high aspect ratio are obtained by this method. (C) 2017 The Society of Manufacturing Engineers. Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码:265 / 271
页数:7
相关论文
共 50 条
  • [1] Experimental Study of Micro Electrochemical Discharge Machining of Ultra-Clear Glass with a Rotating Helical Tool
    Liu, Yong
    Zhang, Chao
    Li, Songsong
    Guo, Chunsheng
    Wei, Zhiyuan
    PROCESSES, 2019, 7 (04)
  • [2] Investigation on Wire Electrochemical Discharge Micro-Machining
    Kong, Weijing
    Liu, Ziyu
    Zhang, Rudong
    Zeng, Yongbin
    MICROMACHINES, 2023, 14 (08)
  • [3] Pulse-Current Wire Electrochemical Machining with Axial Electrolyte Flushing along a Rotating Helical Wire Tool
    Fang, Xiaolong
    Han, Zhao
    Chen, Mi
    Zhu, Di
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2020, 167 (11)
  • [4] Wire electrochemical discharge machining of glass using a surface roughened tool
    Han, M. -S.
    Min, B. -K.
    Lee, S. J.
    4M/ICOMM 2009 - THE GLOBAL CONFERENCE ON MICRO MANUFACTURE, 2009, : 317 - 320
  • [5] Investigation of Kerf in Micro Wire Electro Discharge Machining
    Ali, Mohammad Yeakub
    Khamarruzaman, Siti Nur Zalikha
    Banu, Asfana
    3RD INTERNATIONAL CONFERENCE ON MECHANICAL, AUTOMOTIVE AND AEROSPACE ENGINEERING 2016, 2017, 184
  • [6] Helical surface creation by wire electrical discharge machining for micro tools
    Cheng, X.
    Yang, X. H.
    Huang, Y. M.
    Zheng, G. M.
    Li, Li
    ROBOTICS AND COMPUTER-INTEGRATED MANUFACTURING, 2014, 30 (03) : 287 - 294
  • [7] An investigation into wire electrochemical micro machining of pure tungsten
    He, Haidong
    Zeng, Yongbin
    Qu, Ningsong
    PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY, 2016, 45 : 285 - 291
  • [8] Experimental investigation on electrochemical discharge machining of hastelloy
    Karthik, Kanulla
    Ranjith, R.
    Veduru, Venkatrami Reddy
    Nallasivam, Kawin
    Materials Research Express, 2024, 11 (11)
  • [9] Experimental Investigation for Generation of Micro-Holes on Silicon Wafer Using Electrochemical Discharge Machining Process
    Manpreet Singh
    Sarbjit Singh
    Sanjeev Kumar
    Silicon, 2020, 12 : 1683 - 1689
  • [10] Experimental Investigation for Generation of Micro-Holes on Silicon Wafer Using Electrochemical Discharge Machining Process
    Singh, Manpreet
    Singh, Sarbjit
    Kumar, Sanjeev
    SILICON, 2020, 12 (07) : 1683 - 1689