Performance analysis and structural optimization of a finned liquid-cooling radiator for chip heat dissipation

With the rapid development of computer chips with high heat flux, efficient chip cooling is becoming crucial. In this study, a finned water-cooled radiator is developed and its operational performance is tested through experiments. Furthermore, the finned water-cooled radiator heat dissipation model is established using COMSOL software, and then verified experimentally. The effects of the cooling water inlet and outlet positions, fin height, thickness, and spacing on the thermal resistance and flow resistance performance of the radiator are investigated. Based on this, the radiator structure is theoretically optimized and the required cooling water conditions for maintaining the functioning of the chip at its safe temperature are determined. The central arrangement of the cooling water inlet and outlet type performs better than the traditional diagonal arrangement, and the optimal fin-covered plate area of the radiator is almost equal to the chip area. A fin height of 5 mm, fin thickness of 0.5 mm and fin spacing of 1 mm are recommended. Furthermore, the required cooling water operational conditions corresponding to chip heat flux are considered and the fitting relationship between the cooling water flow and pressure drop is catalogued, which may provide guidance for future cooling system designs.