LIFE PREDICTION MODEL DEVELOPMENT OF BGA SOLDER JOINT UNDER RANDOM VIBRATION

被引：0
|
作者：
Han, Changwoon [1 ]
Oh, Chul-Min [1 ]
Hong, Won-Sik [1 ]
机构：
[1] Korea Elect Technol Inst, Reliabil Phys Res Ctr, Seognam, South Korea
来源：
PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2011, VOL 11 | 2012年
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D O I：
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中图分类号：
TH [机械、仪表工业];
学科分类号：
0802 ;
摘要：
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页码：987 / 988
页数：2
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