Grain boundaries as preferential sites for resistive switching in the HfO2 resistive random access memory structures

被引:173
|
作者
Lanza, M. [1 ]
Zhang, K. [2 ]
Porti, M. [1 ]
Nafria, M. [1 ]
Shen, Z. Y. [2 ]
Liu, L. F. [3 ]
Kang, J. F. [3 ]
Gilmer, D. [4 ]
Bersuker, G. [4 ]
机构
[1] Univ Autonoma Barcelona, Dept Elect Engn, Bellaterra 08193, Spain
[2] Peking Univ, Dept Elect, Key Lab Phys & Chem Nanodevices, Beijing 100871, Peoples R China
[3] Peking Univ, Inst Microelect, Beijing 100871, Peoples R China
[4] SEMATECH, Austin, TX 78741 USA
基金
中国国家自然科学基金;
关键词
BREAKDOWN;
D O I
10.1063/1.3697648
中图分类号
O59 [应用物理学];
学科分类号
摘要
Resistive switching (RS) phenomenon in the HfO2 dielectric has been indirectly observed at device level in previous studies using metal-insulator-metal structures, but its origin remains unclear. In this work, using the enhanced conductive atomic force microscope (ECAFM), we have been able to obtain in situ direct observation of RS with nanometric resolution. The ECAFM measurements reveal that the conductive filaments exhibiting the RS are primarily formed at the grain boundaries, which were shown exhibiting especially low breakdown voltage due to their intrinsic high density of the oxygen vacancies. (C) 2012 American Institute of Physics. [http://dx.doi.org/10.1063/1.3697648]
引用
收藏
页数:4
相关论文
共 50 条
  • [1] Enhanced resistive switching performance for bilayer HfO2/TiO2 resistive random access memory
    Ye, Cong
    Deng, Tengfei
    Zhang, Junchi
    Shen, Liangping
    He, Pin
    Wei, Wei
    Wang, Hao
    [J]. SEMICONDUCTOR SCIENCE AND TECHNOLOGY, 2016, 31 (10)
  • [2] Electric characteristics and resistive switching mechanism of Ni/HfO2/Pt resistive random access memory cell
    Pang Hua
    Deng Ning
    [J]. ACTA PHYSICA SINICA, 2014, 63 (14)
  • [3] Review on role of nanoscale HfO2 switching material in resistive random access memory device
    Napolean A
    Sivamangai NM
    Rajesh S
    NaveenKumar R
    Nithya N
    Kamalnath S
    Aswathy N
    [J]. Emergent Materials, 2022, 5 : 489 - 508
  • [4] Review on role of nanoscale HfO2 switching material in resistive random access memory device
    Napolean, A.
    Sivamangai, N. M.
    Rajesh, S.
    NaveenKumar, R.
    Nithya, N.
    Kamalnath, S.
    Aswathy, N.
    [J]. EMERGENT MATERIALS, 2022, 5 (02) : 489 - 508
  • [5] Investigation of Radiation Hardness of HfO2 Resistive Random Access Memory
    Tsui, Bing-Yue
    Chang, Ko-Chin
    Shew, Bor-Yuan
    Lee, Heng-Yuan
    Tsai, Ming-Jinn
    [J]. PROCEEDINGS OF TECHNICAL PROGRAM - 2014 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS AND APPLICATION (VLSI-TSA), 2014,
  • [6] Well controlled multiple resistive switching states in the Al local doped HfO2 resistive random access memory device
    Chen, Y. S.
    Chen, B.
    Gao, B.
    Liu, L. F.
    Liu, X. Y.
    Kang, J. F.
    [J]. JOURNAL OF APPLIED PHYSICS, 2013, 113 (16)
  • [7] A nonlinear resistive switching behaviors of Ni/HfO2/TiN memory structures for self-rectifying resistive switching memory
    Yun, Min Ju
    Lee, Doowon
    Kim, Sungho
    Wenger, Christian
    Kim, Hee-Dong
    [J]. MATERIALS CHARACTERIZATION, 2021, 182
  • [8] Hf layer thickness dependence of resistive switching characteristics of Ti/Hf/HfO2/Au resistive random access memory device
    Nakajima, Ryo
    Azuma, Atsushi
    Yoshida, Hayato
    Shimizu, Tomohiro
    Ito, Takeshi
    Shingubara, Shoso
    [J]. JAPANESE JOURNAL OF APPLIED PHYSICS, 2018, 57 (06)
  • [9] Low-Power Resistive Switching Characteristic in HfO2/TiOx Bi-Layer Resistive Random-Access Memory
    Xiangxiang Ding
    Yulin Feng
    Peng Huang
    Lifeng Liu
    Jinfeng Kang
    [J]. Nanoscale Research Letters, 2019, 14
  • [10] Low-Power Resistive Switching Characteristic in HfO2/TiOx Bi-Layer Resistive Random-Access Memory
    Ding, Xiangxiang
    Feng, Yulin
    Huang, Peng
    Liu, Lifeng
    Kang, Jinfeng
    [J]. NANOSCALE RESEARCH LETTERS, 2019, 14 (1):