Scalable Design of Two-Dimensional Oxide Nanosheets for Construction of Ultrathin Multilayer Nanocapacitor

Large size of capacitors is the main hurdle in miniaturization of current electronic devices. Herein, a scalable solution-based layer-by-layer engineering of metallic and high-kappa dielectric nanosheets into multilayer nanosheet capacitors (MNCs) with overall thickness of approximate to 20 nm is presented. The MNCs are built through neat tiling of 2D metallic Ru0.95O20.2- and high-kappa dielectric Ca2NaNb4O13- nanosheets via the Langmuir-Blodgett (LB) approach at room temperature which is verified by cross-sectional high-resolution transmission electron microscopy (HRTEM). The resultant MNCs demonstrate a high capacitance of 40-52 mu F cm(-2) and low leakage currents down to 10(-5)-10(-6)A cm(-2). Such MNCs also possess complimentary in situ robust dielectric properties under high-temperature measurements up to 250 degrees C. Based on capacitance normalized by the thickness, the developed MNC outperforms state-of-the-art multilayer ceramic capacitors (MLCC, approximate to 22 mu F cm(-2)/5 x 10(4) nm) present in the market. The strategy is effective due to the advantages of facile, economical, and ambient temperature solution assembly.