Implementation challenges for scalable neuromorphic computing

被引:0
|
作者
Yamamichi, Shintaro [1 ]
Horibe, Akihiro [1 ]
Aoki, Toyohiro [1 ]
Hosokawa, Kohji [1 ]
Hisada, Takashi [1 ]
Mori, Hiroyuki [1 ]
机构
[1] IBM Res Tokyo, Kawasaki, Kanagawa, Japan
关键词
D O I
暂无
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
In the big data era, a new computing system, called Cognitive Computing, that can handle unstructured data, learn and extract the insights is required. A neuromorphic device is a key component for this, and several architectures are reported. Compared to the neuromorphic device with SRAM-based spiking neural network, a cross-bar structure device realizes on-chip leaning, but requires high-density off-chip interconnect, much higher than those for conventional high-end logic devices. Recent progress of solder bumping and 3-dimentional integration technologies are described.
引用
收藏
页码:T182 / T183
页数:2
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