Silicon chips finally bend to shape, thanks to new research

被引：0

|

作者：

不详

机构：

来源：

ELECTRONICS WORLD | 2008年 / 114卷 / 1868期

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

收藏

页码：10 / 10

页数：1

相关论文

共 50 条

[1] NEW WAYS WITH SILICON CHIPS
PAYLING, RQ
[J]. ENGINEERING, 1979, 219 (10): : 1279 - 1281
[2] Silicon chips get new life
不详
[J]. INTECH, 2003, 50 (06) : 12 - 12
[3] Ultrathin Silicon Chips of Arbitrary Shape by Etching Before Grinding
Herwik, S.
Paul, O.
Ruther, P.
[J]. JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2011, 20 (04) : 791 - 793
[4] Silicon chips: Food trend for the new millennium
Hollingsworth, P
[J]. FOOD TECHNOLOGY, 1998, 52 (12) : 54 - +
[5] New chips move networking onto silicon
Ortiz, S
[J]. COMPUTER, 1999, 32 (02) : 7 - 9
[6] Silicon nanowire: A new shape of crystalline silicon
Zhang, YF
Tang, YH
Wang, N
Lee, CS
Yu, DP
Bello, I
Lee, ST
[J]. AMORPHOUS AND MICROCRYSTALLINE SILICON TECHNOLOGY-1998, 1998, 507 : 993 - 998
[7] Bend Me, Shape Me: A Practical Experience of Repurposing Research Data
McKay, Dana
[J]. 2014 IEEE/ACM JOINT CONFERENCE ON DIGITAL LIBRARIES (JCDL), 2014, : 399 - 402
[8] NEW CONTACTS MAY SPELL THE END FOR SILICON CHIPS
不详
[J]. NEW SCIENTIST, 1988, 119 (1625) : 32 - 32
[9] NEW CHIPS COMMUNICATE THE IMPACT OF JAPANESE RESEARCH
BURSKY, D
[J]. ELECTRONIC DESIGN, 1981, 29 (08) : 63 - 68
[10] Real-world requirements shape new ATM chips
Goldberg, L
[J]. ELECTRONIC DESIGN, 1997, 45 (13) : 137 - 142

← 1 2 3 4 5 →