共 50 条
- [1] Fabrication of nickel microbump on aluminum substrate using electroless nickel plating Transactions of the Institute of Metal Finishing, 1996, 74 (pt 4): : 138 - 141
- [2] Electrochemical behavior of iodide at a nickel pentacyanonitrosylferrate film modified aluminum electrode prepared by an electroless procedure JOURNAL OF ELECTROANALYTICAL CHEMISTRY, 2005, 574 (02): : 207 - 216
- [4] Electrochemical measurements of electroless nickel coatings on zincated aluminum substrates Transactions of the Institute of Metal Finishing, 2000, 78 (04): : 157 - 162
- [10] Electroless nickel bumping of aluminum bondpads - Part II: Electroless nickel plating IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2002, 25 (01): : 98 - 105