The effects of an applied electric field on the linear stability in the solidification of a dilute binary alloy

被引:3
|
作者
Hwang, CC
Hsieh, JY
Liu, HH
机构
[1] Department of Mechanical Engineering, Chung Yuan University
关键词
D O I
10.1016/0022-0248(96)00996-7
中图分类号
O7 [晶体学];
学科分类号
0702 ; 070205 ; 0703 ; 080501 ;
摘要
We undertake a linear stability analysis on the crystal-melt interface of a dilute binary alloy under the effects of an electric field. The electric field is allowed to deflect at an angle with the solidifying direction. Under the angle deflection, a stationary mode solution, which occurs in the case of no deflecting angle, will turn into an overstable mode, and the effects of both the strength of the electric field and the deflecting angle on the system is opposite. Quantitatively, we have individually provided the numerical results of four alloys with suitable operating conditions; and an angle deflection is suggested in for the occasions when increasing the strength of the electric field will destabilize the system.
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页码:147 / 155
页数:9
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