The Challenges For Electromagnetic Diagnosis And Control of Power Devices using Wide-Band Gap Semi-conductors

被引:0
|
作者
Larbaig, J. M. [1 ]
Dienot, J. M. [2 ]
Ruscassie, R. [1 ]
Ramos, I [3 ]
机构
[1] Univ Pau Pays Adour, Siame E2S UPPA, Pau, France
[2] Univ Toulouse 3, Siame E2S UPPA, Tarbes, France
[3] Novatem SA, R&D Novatem Lab, Toulouse, France
关键词
electromagnetic; near-field; probe; switching noise; emission; SiC semiconductor; power devices; embedded chip; Printed Circuit Board (PCB); spectral signature; power converter; electrical vehicles;
D O I
10.1109/metroaerospace48742.2020.9160314
中图分类号
V [航空、航天];
学科分类号
08 ; 0825 ;
摘要
The trends for achieving optimized electrical transportation systems, as hybrid vehicles, electric vehicles, trains, and More Electrical Aircrafts (MEA), look promising, with the development of a large number of technological concepts dedicated to embedded-closed volume. With the increasing constraints on efficiency, reliability and compactness of these embedded electrical systems, the electromagnetic integrity becomes a main priority for designers but also for operators. Electromagnetic compatibility and materials' stresses induced by the highly constrained systems are issues which need to be rightfully monitored to achieve optimal design and operation. This paper details the integration process of a set of electromagnetic sensors (H-field probes) in a representative and dedicated SiC power converter environment, with the aim of addressing the real-time extraction difficulties of specific electromagnetic behaviors in an embedded electrical system. The development of such a process was supported by a custom testbench around a dedicated power converter feeding an electric motor. The integrated probes allow constant monitoring the electromagnetic signature at any operational point. Some preliminary results of the integration process are presented, with measured data of the converter in real operating conditions
引用
收藏
页码:205 / 210
页数:6
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