Progress of Plate-laminated Waveguide Slot Array Antennas by Diffusion Bonding in 60GHz, 120GHz and 350GHz Bands

被引：0
|
作者：
Hirokawa, Jiro [1 ]
Tomura, Takashi [1 ]
Hirata, Akihiko [2 ]
Nagatsurna, Tadao [3 ]
机构：
[1] Tokyo Inst Technol, Dept Elect & Elect Engn, Meguro Ku, Tokyo, Japan
[2] Chiba Inst Technol, Dept Informat & Commun Syst, Narashino, Chiba, Japan
[3] Osaka Univ, Dept Syst Innovat, Toyonaka, Osaka, Japan
来源：
2018 ASIA-PACIFIC MICROWAVE CONFERENCE PROCEEDINGS (APMC) | 2018年
关键词：
waveguide; slot antennas; silicon; bonding; FULL-CORPORATE-FEED;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper presents the progress of the plate-laminated waveguide slot array antennas by diffusion bonding in 60GHz, 120GHz and 350GHz bands. The large-size 60GHz-band antenna reduces the weight by using aluminum-alloy plates. The 120GHz-band antenna achieves wideband characteristic by adding a layer of exciting slots. The 350GHz-band antenna introduces gold-coating silicon wafers for high precision in the fabrication.
引用
收藏
页码：426 / 428
页数：3
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