Research on the Virtual Prototype of Grinding System for Wafer Precision Grinding Machine based on Mechanical System Mechanics

被引：0
|
作者：
Sha, Zhihua [1 ]
Zhang, Zongnan [1 ]
Zhang, Shengfang [1 ]
机构：
[1] Dalian Jiaotong Univ, Sch Mech Engn, Dalian, Peoples R China
来源：
APPLIED MECHANICS, MATERIALS, INDUSTRY AND MANUFACTURING ENGINEERING | 2012年 / 164卷
关键词：
Wafer Precision grinding machine; Grinding system; Mechanics; Virtual prototype; Simulation;
D O I：
10.4028/www.scientific.net/AMM.164.330
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
In order to decrease the development costs, shorten the developing cycle, improve the overall performance and reduce the environmental pollution of the wafer precision grinding machine, the structure, transmission, movement of grinding system for wafer precision grinding machine is analyzed based on mechanical system mechanics, the three-dimensional model of the grinding system is established, based on frame animation technology and via secondary development of Pro/E in the environment of VS 2008, the virtual prototype of grinding system for wafer precision grinding machine is developed, the kinematics and dynamics simulation of the grinding system is realized.
引用
收藏
页码：330 / 333
页数：4
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