Measurement of three-dimensional temperature fields with interferometric tomography

被引:18
|
作者
Wu, DL [1 ]
He, AZ [1 ]
机构
[1] Nanjing Univ Sci & Technol, Dept Appl Phys, Nanjing 210094, Peoples R China
关键词
D O I
10.1364/AO.38.003468
中图分类号
O43 [光学];
学科分类号
070207 ; 0803 ;
摘要
Optical computerized tomography (OCT) technology is used to reconstruct the asymmetric three-dimensional temperature field generated by radiators and electronic chips. First, the OCT method is described. Second, the reconstructed results are tested by a double-cylinder radiator model. Finally, OCT is applied to reconstruction of the temperature field above the surface of a CPU. The air-temperature field above a CPU circuit can be imaged with an OCT system that reflects whether the heat production from different parts of the CPU is even; therefore possibly the technique can be used to determine whether the integrated-circuit design in the CPU is smart. (C) 1999 Optical Society of America. OCIS codes: 040.1520, 050.2230, 100.6950, 110.6960, 120.3180, 200.1130.
引用
收藏
页码:3468 / 3473
页数:6
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