Electrical modelling of enhanced ball grid array packages using coupled transmission lines

被引：2
|
作者：
Horng, TS [1 ]
Wu, SM [1 ]
Tseng, A [1 ]
Huang, HH [1 ]
机构：
[1] Natl Sun Yat Sen Univ, Dept Elect Engn, Kaohsiung 804, Taiwan
来源：
ELECTRONICS LETTERS | 1999年 / 35卷 / 18期
关键词：
D O I：
10.1049/el:19991055
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Frequency-domain S-parameter measurement techniques are used to establish the high-frequency/high-speed equivalent circuit models of enhanced ball grid array packages. By considering the longest coupled traces of the packages, the coupled transmission-line parameters found include the characteristic impedance, coupling coefficient and propagation delay. The equivalent lumped models have been further derived from coupled transmission line models using the concept of distributed circuits.
引用
收藏
页码：1567 / 1569
页数：3
相关论文
共 50 条
  • [1] RF modeling of ball grid array packages using a coupled transmission line model
    Lai, YL
    Wu, CL
    Chiang, K
    [J]. 2003 IEEE RADIO FREQUENCY INTEGRATED CIRCUITS (RFIC) SYMPOSIUM, DIGEST OF PAPERS, 2003, : 351 - 354
  • [2] Thermal and thermomechanical modelling of ball grid array packages
    Fromont, T
    [J]. THERMAL MANAGEMENT OF ELECTRONIC SYSTEMS II, 1997, : 329 - 338
  • [3] Through-transmission acoustic inspection of ball grid array (BGA) packages
    Moore, TM
    Hartfield, CD
    [J]. ISTFA '97 - PROCEEDINGS OF THE 23RD INTERNATIONAL SYMPOSIUM FOR TESTING AND FAILURE ANALYSIS, 1997, : 197 - 204
  • [4] Electrical analysis of IC packaging with emphasis on different ball grid array packages
    Unchwaniwala, KB
    Caggiano, MF
    [J]. 51ST ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2001, : 1496 - 1501
  • [5] Comparison of advanced measurement and modeling techniques for electrical characterization of Ball Grid Array packages
    Horng, TS
    Tseng, A
    Huang, HH
    Wu, SM
    Lee, JJ
    [J]. 48TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1998 PROCEEDINGS, 1998, : 1464 - 1471
  • [6] Solder ball failure mechanisms in plastic ball grid array packages
    Zhong, CH
    Yi, S
    Whalley, DC
    [J]. SOLDERING & SURFACE MOUNT TECHNOLOGY, 2002, 14 (02) : 40 - 50
  • [7] Compact conduction model of ball grid array packages
    Refai-Ahmed, G
    Karimanal, KV
    [J]. IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2003, 26 (03): : 610 - 615
  • [8] Modeling the electrical parasitics for large I/O ball grid array packages for RF applications
    Caggiano, Michael F.
    Ou, Jack
    Tatikola, Ramani
    [J]. IETE Technical Review (Institution of Electronics and Telecommunication Engineers, India), 2001, 18 (2-3): : 99 - 107
  • [9] Modeling the electrical parasitics for large I/O ball grid array packages for RF applications
    Caggiano, MF
    Ou, J
    Tatikola, R
    [J]. IETE TECHNICAL REVIEW, 2001, 18 (2-3) : 99 - 107
  • [10] Missing solder ball failure mechanisms in plastic ball grid array packages
    Zhong, CH
    Yi, S
    Mui, YC
    Howe, CP
    Olsen, D
    Chen, WT
    [J]. 50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS, 2000, : 151 - 159
12345