Submicrometre-resolution polychromatic three-dimensional X-ray microscopy

被引:43
|
作者
Larson, B. C. [1 ]
Levine, L. E. [2 ]
机构
[1] Oak Ridge Natl Lab, Div Mat Sci & Technol, Oak Ridge, TN 37831 USA
[2] NIST, Mat Measurement Lab, Gaithersburg, MD 20899 USA
关键词
RANGE INTERNAL-STRESSES; MICROBEAM DIFFRACTION; STRUCTURAL MICROSCOPY; PLASTIC-DEFORMATION; STRAIN; MICRODIFFRACTION; COPPER; ELECTROMIGRATION; MICROSTRUCTURE; MECHANICS;
D O I
10.1107/S0021889812043737
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
The ability to study the structure, microstructure and evolution of materials with increasing spatial resolution is fundamental to achieving a full understanding of the underlying science of materials. Polychromatic three-dimensional X-ray microscopy (3DXM) is a recently developed nondestructive diffraction technique that enables crystallographic phase identification, determination of local crystal orientations, grain morphologies, grain interface types and orientations, and in favorable cases direct determination of the deviatoric elastic strain tensor with submicrometre spatial resolution in all three dimensions. With the added capability of an energy-scanning incident beam monochromator, the determination of absolute lattice parameters is enabled, allowing specification of the complete elastic strain tensor with three-dimensional spatial resolution. The methods associated with 3DXM are described and key applications of 3DXM are discussed, including studies of deformation in single-crystal and polycrystalline metals and semiconductors, indentation deformation, thermal grain growth in polycrystalline aluminium, the metal-insulator transition in nanoplatelet VO2, interface strengths in metal-matrix composites, high-pressure science, Sn whisker growth, and electromigration processes. Finally, the outlook for future developments associated with this technique is described.
引用
收藏
页码:153 / 164
页数:12
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