Ultra-Wideband GaN MMIC Chip Set and High Power Amplifier Module for Multi-Function Defense AESA Applications

被引:48
|
作者
Schmid, Ulf [1 ]
Sledzik, Hardy [1 ]
Schuh, Patrick [1 ]
Schroth, Joerg [1 ]
Oppermann, Martin [1 ]
Brueckner, Peter [2 ]
van Raay, Friedbert [2 ]
Quay, Ruediger [2 ]
Seelmann-Eggebert, Matthias [2 ]
机构
[1] Cassidian, Dept TR Modules & MMICs, D-89077 Ulm, Germany
[2] Fraunhofer Inst Appl Solid State Phys IAF, D-79108 Freiburg, Germany
关键词
Gallium nitride (GaN); high power amplifiers (HPAs); microwave integrated circuits; transmit modules; ultra-wideband technology;
D O I
10.1109/TMTT.2013.2268055
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper presents measurement results of a monolithic microwave integrated circuit (MMIC) chip set and of an ultra-wideband high power amplifier (HPA) transmit module for multi-functional next-generation active electronically scanned antenna radar/electronic warfare/communication applications targeting the frequency range from 6 to 18 GHz. The reported chip set consists of a driver amplifier (DA) MMIC and an HPA MMIC on a high-power gallium-nitride process with high electronic-mobility transistors. The DA reaches a power gain of 11 dB and maximum output power of 2 W, which is sufficient to drive a final stage in a balanced configuration. The HPA reaches a typical output power of 12.5 and 10.6 W in pulsed and continuous wave (CW) operation, respectively. Measurements on the module level indicate 18.5-W typical output power in both pulsed and CW operation.
引用
收藏
页码:3043 / 3051
页数:9
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