Electrochemical behavior of a lead-free Sn-Cu solder alloy in NaCl solution

被引：52

作者：

Osorio, Wislei R. ^{[1
,2
]}

Freitas, Emmanuelle S. ^{[2
]}

Spinelli, Jose E. ^{[3
]}

Garcia, Amauri ^{[2
]}

机构：

[1] Univ Estadual Campinas, UNICAMP, Sch Appl Sci FCA, BR-13484350 Limeira, SP, Brazil

[2] Univ Estadual Campinas, UN1CAMP, Dept Mat Engn, BR-13083970 Campinas, SP, Brazil

[3] Fed Univ Sao Carlos UFSCar, Dept Mat Engn, BR-13565905 Sao Carlos, SP, Brazil

来源：

CORROSION SCIENCE | 2014年 / 80卷

基金：

巴西圣保罗研究基金会;

关键词：

Tin; Solder; EIS; Polarization; Corrosion; Metallurgy; MECHANICAL-PROPERTIES; CORROSION BEHAVIOR; DIRECTIONAL SOLIDIFICATION; INTERMETALLIC COMPOUNDS; MICROSTRUCTURE; PARAMETERS; ZN; AG; AG3SN; INHIBITION;

D O I：

10.1016/j.corsci.2013.11.010

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Electrochemical impedance spectroscopy (EIS), potentiodynamic polarization techniques and an equivalent circuit analysis are used to evaluate the electrochemical corrosion behavior of Sn-Cu alloy samples in a naturally aerated 0.5 M NaCl solution at 25 degrees C It has been found that a better electrochemical corrosion resistance is provided by a coarser cellular microstructure array. It has also been found that the corrosion current density (i(corr)) is of about a quarter when compared with that of the finest microstructure examined. Such behavior is attributed to both localized strains between the Sn-rich phase and intermetallic (IMC) particles and the cathode/anode area ratios. The effect of copper alloying on i(corr), is also discussed. (C) 2013 Elsevier Ltd. All rights reserved.

引用

页码：71 / 81

页数：11

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