Research on the preparation of the low density material with high volume filling rate of phenolic hollow microsphere

被引:0
|
作者
He Xue Tao [1 ]
Shao Jian Bo [1 ]
An Ying [1 ]
Ma Kun [1 ]
Wang Jian Qiang [1 ]
Yang Wei Min [1 ,2 ]
机构
[1] Beijing Univ Chem Technol, Coll Mech & Elect Engn, Beijing 100029, Peoples R China
[2] Beijing Univ Chem Technol, State Key Lab Organ Inorgan Composites, Beijing 100029, Peoples R China
来源
关键词
phenolic hollow microsphere; epoxy resin; blends; low density material; production process; SYNTACTIC FOAM; FRACTURE; MICROSTRUCTURES;
D O I
10.4028/www.scientific.net/KEM.561.135
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In this paper, an experimental mixing equipment has been developed for producing low density material with a high volume filling rate of phenolic hollow microsphere. The experiments with the equipment aim to explore the feasibility of this equipment for industrial production and to optimize the process. Experiments have been made to evaluate the influence of the filling ratio and the mixing rotor movement on the mixing effect. The results show that when the volume filling ratio of the material to the mixing barrel is about 40% the mixing effect is the best. But with mixing time increasing, the broken ratio of hollow microsphere will increase too. To solve this problem, some changes on the rotor movement have been made. The results show that the broken ratio increasing rate becomes lower and the density becomes more uniform. These indicate that the broken ratio can be well controlled by a suitable production process.
引用
收藏
页码:135 / +
页数:3
相关论文
共 50 条
  • [1] Preparation and characterization of hollow glass microsphere ceramics and silica aerogel/hollow glass microsphere ceramics having low density and low thermal conductivity
    Ding, Junjie
    Liu, Qiang
    Zhang, Biao
    Ye, Feng
    Gao, Ye
    JOURNAL OF ALLOYS AND COMPOUNDS, 2020, 831
  • [2] Research and preparation of low-density high-strength carbon material
    Xia, Jin-Tong (xjt8821059@163.com), 1600, Hunan University (43):
  • [3] Effect of the filling position and filling rate of the insulation material on the insulation performance of the hollow block
    Hu, Wentao
    Xia, Yueqiu
    Li, Feng
    Yu, Hanting
    Hou, Chaoping
    Meng, Xi
    CASE STUDIES IN THERMAL ENGINEERING, 2021, 26
  • [4] Performance research on the phenolic foamed material of high density and non-inflammability
    Fu, Jun
    Xinxing Jianzhu Cailiao/New Building Materials, (12): : 41 - 43
  • [5] Preparation of Hollow Glass Microsphere/Organic Silicone Resin Composite Material with Low Dielectric Constant by In-Situ Polymerization
    Yuan, Yan
    Diao, Shen
    Zhao, Caide
    Ge, Shuhua
    Wang, Xue
    Duan, Baorong
    SILICON, 2020, 12 (06) : 1417 - 1423
  • [6] Preparation of Hollow Glass Microsphere/Organic Silicone Resin Composite Material with Low Dielectric Constant by In-Situ Polymerization
    Yan Yuan
    Shen Diao
    Caide Zhao
    Shuhua Ge
    Xue Wang
    Baorong Duan
    Silicon, 2020, 12 : 1417 - 1423
  • [7] Preparation and performance of hollow ceramic microsphere composites with high-temperature resistance, low thermal conductivity and toughness
    Liu H.
    Huang Y.
    Jin M.
    Tang S.
    He J.
    Wang C.
    Fuhe Cailiao Xuebao/Acta Materiae Compositae Sinica, 2022, 39 (05): : 2378 - 2386
  • [8] Experimental Research on Low Cost Paste Filling Material
    Zhan, Xiaoyuan
    Wang, Fang
    Shi, Yongkui
    Chen, Lianjun
    Wang, Chunguang
    3RD INTERNATIONAL WORKSHOP ON MINE HAZARDS PREVENTION AND CONTROL, 2013, 94 : 581 - 585
  • [9] The effect of strain rate and filler volume fraction on the mechanical properties of hollow glass microsphere modified polymer
    Zhang, Xin
    Wang, Pengfei
    Zhou, Yihao
    Li, Xiaotuo
    Yang, En-Hua
    Yu, T. X.
    Yang, Jinglei
    COMPOSITES PART B-ENGINEERING, 2016, 101 : 53 - 63
  • [10] Preparation and Properties of Hollow Glass Microsphere/Silicone Rubber Composite Material with the Transition Layer of Silicone Resin
    Zhao, Caide
    Diao, Shen
    Yuan, Yan
    Wang, Mingying
    SILICON, 2021, 13 (02) : 517 - 522