Effect of seeding on the thermal conductivity of self-reinforced silicon nitride

被引：58
|
作者：
Hirosaki, N
Okamoto, Y
Munakata, F
Akimune, Y
机构：
[1] Natl Inst Res Inorgan Mat, Tsukuba, Ibaraki 3050044, Japan
[2] Nissan Motor Co Ltd, Mat Res Lab, Yokosuka, Kanagawa 2378523, Japan
来源：
JOURNAL OF THE EUROPEAN CERAMIC SOCIETY | 1999年 / 19卷 / 12期
关键词：
grain growth; microstructure-final; thermal conductivity; Si3N4; seeding;
D O I：
10.1016/S0955-2219(99)00030-8
中图分类号：
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
Thermal conductivity of Si3N4 containing large beta-Si3N4 particles as seeds for grain growth was investigated. Seeds addition promotes growth of beta-Si3N4 grains during sintering to develop the duplex microstructure. The thermal conductivity of the material sintered at 1900 degrees C improved up to 106 Wm(-1)K(-1) although that of unseeded material was 77 Wm(-1)K(-1) Seeds addition leads to reduction of the sintering temperature with developing the duplex microstructure and with improving the thermal conductivity, which benefits in terms of production cost of Si3N4 ceramics with thermal conductivity. (C) 1999 Elsevier Science Limited. All rights reserved.
引用
收藏
页码：2183 / 2187
页数：5
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