Optimization of ion-track etching and electrochemical Cu nanocone deposition for field emission cathodes

被引：0

作者：

Jordan, F. ^{[1
]}

Serbun, P. ^{[1
]}

Navitski, A. ^{[1
]}

Luetzenkirchen-Hecht, D. ^{[1
]}

Mueller, G. ^{[1
]}

Alber, I.

Toimil-Molares, M. E.

Trautmann, C. ^{[2
]}

机构：

[1] Univ Wuppertal, FB Phys Dept C, Wuppertal, Germany

[2] Tech Univ Darmstadt, Darmstadt, Germany

来源：

2012 25TH INTERNATIONAL VACUUM NANOELECTRONICS CONFERENCE (IVNC) | 2012年

关键词：

copper nanocones; field emission; current limits;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We have fabricated patch-structured nanocone (NC) cathodes by using asymmetrically etched ion-track membranes which were metallized and fixed on flat holders. The conical channels of these templates were filled by potentiostatic copper deposition resulting in freestanding Cu-NC of similar to 28 mu m length, similar to 3 mu m base, and 160-240 nm tip diameter. Fairly homogeneous and well-aligned field emission from all patches was obtained due to the high NC (10(5) cm(-2)) and emitter densities (similar to 3/patch). Local measurements of selected spots and patches show distinct current jumps at mu A levels. SEM images of the processed areas reveal morphological changes proving a successive destruction of single Cu-NCs. Nevertheless, improved current values of similar to 300 mu A at reduced fields of 30-50 V/mu m have been achieved for the best Cu-NC patches.

引用

页码：58 / +

页数：2

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