Thermal Fatigue and Mechanical Fatigue Behavior of Board Level Solder Joint

被引：0

作者：

Lin Jian ^{[1
]}

Lei Yongping ^{[1
]}

Wu Zhongwei ^{[1
]}

Yang Shuo ^{[1
]}

机构：

[1] Beijing Univ Technol, Beijing 100124, Peoples R China

来源：

RARE METAL MATERIALS AND ENGINEERING | 2013年 / 42卷 / 09期

关键词：

SMT; board level solder joint; thermal fatigue; mechanical fatigue; inelastic strain;

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The thermal fatigue behavior and mechanical fatigue behavior of board level solder joint were investigated by experimental testing and numerical simulation. And two kinds of solder materials, including traditional eutectic lead-tin solder and SAC305 lead-free solder, were considered. Results show that the lead-free solder (SAC305) joint has a longer thermal fatigue lifetime, but a shorter mechanical fatigue lifetime than the eutectic solder joint. Therefore, the evolutions of inelastic strains, including creep and plastic strain, caused by thermal fatigue and mechanical fatigue loading in the solder joint were analyzed by a finite element method. And the difference of solder joint's thermal fatigue and mechanical fatigue behavior was presented.

引用

页码：1874 / 1878

页数：5

共 10 条

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