High-end sensors: challenges for the future

被引:0
|
作者
Yurish, Sergey Y. [1 ,2 ]
机构
[1] Int Frequency Sensor Assoc IFSA, C Esteve Terradas 1,RDIT-K2M Castelldefels, Barcelona, Spain
[2] F2D Ltd, Dublin, Ireland
来源
关键词
D O I
10.1088/1742-6596/1379/1/012003
中图分类号
TH7 [仪器、仪表];
学科分类号
0804 ; 080401 ; 081102 ;
摘要
The paper describes the coming challenges in high-end sensors and transducers design. These challenges are coming from the recent technological limitations in microelectronics. The proposed approach to overcome such limitations is based on programmable parameter-to-frequency converters as a digital sensor's core and advanced method of measurement in order to move from a traditional analog-to-digital conversion to alternative frequency (period, duty-cycle, time interval)-to-digital conversion. Working in the frequency-time signal domain simplifies design, and obviates some technical and technological problems, due to the properties of frequency as informative parameter of sensors and transducers. The major benefits offered by such approach are high reliability, high metrological performance, wide functionality, cost effectiveness and scalability. The perspectives, which will bring such approach to various sensors and transducers for physical and chemical, electrical and nonelectrical quantities are illustrated by examples of multivariable sensors, sensors for smart health care and wearable sensors.
引用
收藏
页数:6
相关论文
共 50 条
  • [1] Signal Processing in High-End Hearing Aids: State of the Art, Challenges, and Future Trends
    V. Hamacher
    J. Chalupper
    J. Eggers
    E. Fischer
    U. Kornagel
    H. Puder
    U. Rass
    [J]. EURASIP Journal on Advances in Signal Processing, 2005
  • [2] Signal processing in high-end hearing aids: State of the art, challenges, and future trends
    Hamacher, V
    Chalupper, J
    Eggers, J
    Fischer, E
    Kornagel, U
    Puder, H
    Rass, U
    [J]. EURASIP JOURNAL ON APPLIED SIGNAL PROCESSING, 2005, 2005 (18) : 2915 - 2929
  • [3] Future prospects of high-end laser projectors
    Janssens, Peter
    Malfait, Koen
    [J]. EMERGING LIQUID CRYSTAL TECHNOLOGIES IV, 2009, 7232
  • [4] High-End Computing challenges in aerospace design and engineering
    Bailey, F. Ronald
    [J]. COMPUTATIONAL FLUID DYNAMICS 2004, PROCEEDINGS, 2006, : 13 - 26
  • [5] Network processors for future high-end systems and applications
    Papaefstathiou, I
    Nikolaou, NA
    Doshi, B
    Grosse, E
    [J]. IEEE MICRO, 2004, 24 (05) : 7 - 9
  • [6] 3D Packaging Challenges for High-End Applications
    Agarwal, Rahul
    Kannan, Sukeshwar
    England, Luke
    Reed, Rick
    Song, Yong
    Lee, WangGu
    Lee, SangHyoun
    Yoo, JinKun
    [J]. 2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017), 2017, : 1249 - 1256
  • [7] Practical Data Value Speculation for Future High-end Processors
    Perais, Arthur
    Seznec, Andre
    [J]. 2014 20TH IEEE INTERNATIONAL SYMPOSIUM ON HIGH PERFORMANCE COMPUTER ARCHITECTURE (HPCA-20), 2014, : 428 - 439
  • [9] HIGH-END ULTRAPORTABLES
    不详
    [J]. BYTE, 1995, 20 (10): : 148 - 148
  • [10] The high-end goods
    Kruger, D
    [J]. FORBES, 2003, 171 (01): : 38 - 38