A Parametric Study on the Elliptical hole Effects of Laminate Composite Plates under Thermal Buckling Load

In this study, a thermal buckling analysis of laminate composite square plate was performed with elliptical hole cutout using the finite element method. Graphite/Epoxy laminate plate used in this study is symmetrical stacking sequence plate [(0/90)(2)]s. This laminate square plate was subjected to temperature loading with clamped support on all edges. Moreover, the parameters considered were fiber orientation (theta), a/b ratio (elliptical hole), elliptical hole inclination (phi), thermal expansion coefficient ratio (alpha(1)/alpha(2)), and thickness of plates (t). The results showed that as the thermal expansion coefficient ratio changes, the elliptical hole ratio and the elliptical hole inclination have inconsequential effects on the performance of the resistance of laminate composite plates. The maximum values of thermal buckling amplification factor were obtained when the ratio a/b = 1.0, which is a circle cutout, while the minimum values were obtained when the ratio a/b = 0.5, regardless of the thickness of plates. Moreover, the plate with elliptical or circle cutout hole provides about 4% to 9% higher buckling resistance than that of the plate without hole cutout, because when subjected to temperature loading the plate with hole can release stress better than the plate without hole.