Novel organic chip packaging technology and impacts on high speed interfaces

被引：1

作者：

Garben, B ^{[1
]}

Huber, A ^{[1
]}

Kaller, D ^{[1
]}

Klink, E ^{[1
]}

Grivet-Talocia, S ^{[1
]}

Duca, C ^{[1
]}

Katopis, GA ^{[1
]}

机构：

[1] IBM Deutschland Entwicklung GmbH, D-7032 Boblingen, Germany

来源：

ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING | 2002年

关键词：

D O I：

10.1109/EPEP.2002.1057921

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The high dense interconnect (HDI) organic chip packaging technology has made rapid development advancements in the last few years. Due to the dense wiring structures in the build up layers and newly also in the laminated core, high signal I/O applications and dense chip area array footprints can be supported. These technology improvements allow specific applications. In this paper the electrical characteristics of the HDI organic chip packaging technology are described with regards to signal and power noise. In addition the impact on high speed data transmission and the performance differences between single-chip module (SCM) and multi-chip modules (MCM) are discussed.

引用

页码：231 / 234

页数：4

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