Microstructure, electrical, mechanical and thermal properties of melt-spun bismuth-tin eutectic alloy

被引：0
|
作者：
Kamal, M
Mazen, S
El-Bediwi, AB [1 ]
Kashita, E
机构：
[1] Mansoura Univ, Fac Sci, Dept Phys, Mansoura, Egypt
[2] Zagazig Univ, Fac Sci, Dept Phys, Zagazig, Egypt
来源：
RADIATION EFFECTS AND DEFECTS IN SOLIDS | 2006年 / 161卷 / 02期
关键词：
electrical resistivity; mechanical and thermal properties; lead-free solder;
D O I：
10.1080/10420150500493709
中图分类号：
TL [原子能技术]; O571 [原子核物理学];
学科分类号：
0827 ; 082701 ;
摘要：
Microstructure, electrical, mechanical and thermal properties of melt-spun Bi58Sn42 eutectic alloy have been investigated using scanning electron microscopy, X-ray analysis, the double bridge method, dynamic resonance method, Vickers hardness measurement and thermal analysis. The structure and physical properties of this alloy are affected by the preparation method (rapid solidification technique). The bismuth-tin eutectic alloy has good properties as a lead-free solder alloy, such as low melting point and adequate cost and mechanical properties when compared with commercial tin-lead solder alloys.
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收藏
页码：143 / 148
页数：6
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