共 50 条
- [1] A drop-impact reliability assessment of mobile display modules using a statistical modeling approach [J]. Journal of Mechanical Science and Technology, 2020, 34 : 3945 - 3955
- [4] Drop-impact reliability of chip-scale packages in handheld products [J]. ELECTRONIC AND PHOTONIC PACKAGING, ELECTRICAL SYSTEMS AND PHOTONIC DESIGN AND NANOTECHNOLOGY - 2003, 2003, : 135 - 143
- [5] Models for reliability prediction of fine-pitch BGAs and CSPs in shock and drop-impact [J]. 54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2004, : 1296 - 1303
- [6] Stress–Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modeling [J]. Journal of Electronic Materials, 2008, 37 : 829 - 836
- [7] Models for reliability prediction. of fine-pitch BGAs and CSPs in shock and drop-impact [J]. IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2006, 29 (03): : 464 - 474
- [9] Underfill Optimization under Accelerated Temperature Cycling and Drop-Impact Loading for Stacked Packages using Finite Element Modeling [J]. 2009 IEEE 59TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, VOLS 1-4, 2009, : 570 - 577