Printed SAW Transponder Package for Rapid Prototyping of Electronic Packages

被引:0
|
作者
Roshanghias, Ali [1 ]
Krivec, Matic [1 ]
Bardong, Jochen [1 ]
Abram, Anze [2 ]
Binder, Alfred [1 ]
机构
[1] CTR Carinthian Tech Res, A-9524 Villach, Austria
[2] Jozef Stefan Inst, Jamova 39, Ljubljana 1000, Slovenia
关键词
TRACKS;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A great deal of attention has been attracted to the additive manufacturing technique of 3D printing in rapid prototyping of electronic packages. This technique enables fast and reliable production of complex structures with arbitrary configurations and possesses several advantages over the conventional manufacturing methods, such as mechanical machining and laser cutting. In addition, 3D printed packages can be considered as a tryout for the assessment of customized design prior to mass production, which will significantly reduce the expensive machining costs and material waste. This study proposes an innovative approach to construct simple radio frequency identification (RFID) package by integrating a surface acoustic wave (SAW) transponder in a 3D printed housing. On that account, an acrylate-type plastic SAW transponder housing was 3D-printed, and the corresponding wireless antenna and contact pads were produced via ink-jet printing with a silver nanoparticle (NP) ink. The proper functionality of the silver tracks was obtained by sintering the printed NPs using a photonic curing device. A flip-chip configuration has been pursued for connecting the chip pads to the corresponding pads on the housing. The performance of the package has been tested with a wireless reading unit via antenna-bridge for SAW transponders.
引用
收藏
页数:4
相关论文
共 50 条
  • [1] Rapid prototyping in Printed Electronics
    Walpuski, Bartlomiej
    Szalapak, Jerzy J.
    Podsiadly, Bartlomiej J.
    Walter, Piotr A.
    Sloma, Marcin
    PHOTONICS APPLICATIONS IN ASTRONOMY, COMMUNICATIONS, INDUSTRY, AND HIGH-ENERGY PHYSICS EXPERIMENTS 2018, 2018, 10808
  • [2] Rapid prototyping of printed circuit boards
    Crum, Susan
    Electronic Packaging and Production, 1995, 35 (02): : 58 - 60
  • [3] Metallic 3D Printed Rectangular Waveguides (WR3) for Rapid Prototyping of THz Packages
    Makhlouf, Sumer
    Khani, Besher
    Lackmann, Joerg
    Duelme, Sebastian
    Stoehr, Andreas
    2018 FIRST INTERNATIONAL WORKSHOP ON MOBILE TERAHERTZ SYSTEMS (IWMTS), 2018,
  • [4] A software package for rapid prototyping of repetitive distributed control
    Stanczyk, J
    Banaszak, ZA
    KNOWLEDGE-BASED SOFTWARE ENGINEERING, 2000, 62 : 199 - 202
  • [5] Rapid Prototyping of Embedded Electronic Systems
    Müller-Glaser, Klaus D.
    Burst, Alexander
    Spitzer, Bernhard
    Kühl, Markus
    IT - Information Technology, 2000, 42 (02): : 8 - 15
  • [6] Aerosol Jet Printing For Printed Electronics Rapid Prototyping
    Gupta, Anubha A.
    Bolduc, Antoine
    Cloutier, Sylvain G.
    Izquierdo, Ricardo
    2016 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS (ISCAS), 2016, : 866 - 869
  • [7] Rapid prototyping technology expands into electronic assemblies
    Pickering, Paul
    ECN Electronic Component News, 2015, 59 (11): : 24 - 25
  • [8] Advanced Package Prototyping Using Nano-Particle Silver Printed Interconnects
    Joo, Sungchul
    Baldwin, Daniel F.
    IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2010, 33 (02): : 129 - 134
  • [9] Rapid Prototyping of 3d Printed Inflatable Forms
    Mikesell, Daniel
    TEI'22: PROCEEDINGS OF THE SIXTEENTH INTERNATIONAL CONFERENCE ON TANGIBLE, EMBEDDED, AND EMBODIED INTERACTION, 2022,
  • [10] Rapid Prototyping of MOX Gas Sensors in Form-Factor of SMD Packages
    Samotaev, N.
    Oblov, K.
    Ivanova, A.
    Gorshkova, A.
    Podlepetsky, B.
    2019 IEEE 31ST INTERNATIONAL CONFERENCE ON MICROELECTRONICS (MIEL 2019), 2019, : 157 - 160