Analysis of the TFT-LCD electrode erosion (lead open) defect

被引:0
|
作者
Mi, Zhang [1 ]
Jian, Guo [1 ]
Long Chunping [1 ]
机构
[1] BOE Technol Grp CO LTD, Beijing 100016, Peoples R China
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Through analyzing TFT-LCD lead open by microscope and SEM & FIB, we find that most of them are caused by electrochemical corrosion. We demonstrate that the crack of the insulator layer during cell and module process is the main reason for the driver electrode erosion. A novel LCD lead area ACF removal process is implemented in module rework process, and we reinforce the module rework adjustment and inspection flow. From the statistical results, the failure ratio of lead open descends sharply and the lead open defects caused by erosion decrease by 498ppm.
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页码:94 / 97
页数:4
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