Calculation and Modeling of EMI from Integrated Circuits inside High-Speed Network Devices

This work presents a numerical approach to the modeling of Electromagnetic Interference (EMI) from the emissions of ICs and PCBs inside rectangular metallic enclosures of network devices. The ICs are modeled as small magnetic and electric dipoles. Their interaction with the enclosures is studied with the dyadic Green's functions. Several calculation examples of surface current density on the metallic walls are given due to dipoles parallel to all directions. A Probabilistic Model is created from magnetic probe measurements in various types of router devices. Monte Carlo simulation is applied in order to perform a worst-case analysis. The applications of the above approach in PCB design are discussed.