CHARACTERIZATION OF THERMAL INTERFACE MATERIALS USING A STEADY STATE EXPERIMENTAL METHOD

被引:0
|
作者
Sponagle, Benjamin [1 ]
Groulx, Dominic [1 ]
机构
[1] Dalhousie Univ, Halifax, NS, Canada
关键词
FLASH METHOD; DIFFUSIVITY;
D O I
暂无
中图分类号
TH [机械、仪表工业];
学科分类号
0802 ;
摘要
One method for characterizing the contact conductance of Thermal Interface Materials (TIMs) is the steady state one dimensional heat flow method typified by ASTM D5470. A test apparatus and procedure were developed which use the basic theory of steady state testing TIMs and improves upon the accuracy and repeatability of the standard test. This procedure and apparatus were used to test the contact conductance of the interface four commercial available TIMs. These materials include: Laird Tflex 720, Laird Tmate 2905c, Chomerics Cho-Therm T500, and Chomerics Cho-Therm 1671. It was found that the Laird products underperformed the available manufacturer published values and the Chomerics products only met performance expectations at relatively high clamping pressures (400 psi).
引用
收藏
页码:641 / 648
页数:8
相关论文
共 50 条
  • [1] Limitations and Accuracy of Steady State Technique for Thermal Characterization of Thermal Interface Materials and Substrates
    AboRas, Mohamad
    May, Daniel
    Schacht, Ralph
    Winkler, Thomas
    Rzepka, Sven
    Michel, Bernd
    Wunderle, Bernhard
    2014 IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM), 2014, : 1285 - 1293
  • [2] Thermal characterization of the thermal interface materials using the three-omega method
    Grosse, Corinna
    Ras, Mohamad Abo
    Varpula, Aapo
    Grigoras, Kestutis
    May, Daniel
    Prunnila, Mika
    Wunderle, Bernhard
    2018 7TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC), 2018,
  • [3] A novel steady-state method for measuring thermal conductivity of thermal interface materials with miniaturized thermal test chips
    Meng, Xinhao
    Jiao, Binbin
    Ye, Yuxin
    Kong, Yanmei
    Liu, Ruiwen
    Yu, Lihang
    Qiao, Jingping
    Lu, Dichen
    Liu, Ziyu
    MEASUREMENT, 2025, 242
  • [4] Measurement of thermal interface conductance at variable clamping pressures using a steady state method
    Sponagle, Benjamin
    Groulx, Dominic
    APPLIED THERMAL ENGINEERING, 2016, 96 : 671 - 681
  • [5] Efficient Method for Characterization of Various Thermal Interface Materials
    Cummings, M.
    Shephard, N.
    Su, K.
    Bhagwagar, D.
    2010 12TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, 2010,
  • [6] Modeling and Experimental Characterization of Metal Microtextured Thermal Interface Materials
    Kempers, R.
    Lyons, A. M.
    Robinson, A. J.
    JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, 2014, 136 (01):
  • [7] Thermal characterization of thermal interface materials
    Chen, C. I.
    Ni, C. Y.
    Chang, C. M.
    Liu, D. S.
    Pan, H. Y.
    Yuan, T. D.
    EXPERIMENTAL TECHNIQUES, 2008, 32 (03) : 48 - 52
  • [8] Thermal characterization of thermal interface materials
    C. I. Chen
    C. Y. Ni
    C. M. Chang
    D. S. Liu
    H. Y. Pan
    T. D. Yuan
    Experimental Techniques, 2008, 32 : 48 - 52
  • [9] Characterization of thermal interface materials
    Schacht, Ralph
    May, Daniel
    Wunderle, Bernhard
    Wittler, Olaf
    Gollhardt, Astrid
    Michell, Bernd
    Reichl, Herbert
    ESTC 2006: 1ST ELECTRONICS SYSTEMINTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2006, : 1367 - +
  • [10] Limitations and Accuracy of Steady State Technique for Thermal Characterization of solid and composite materials
    AboRas, Mohamad
    Wunderle, Bernhard
    May, Daniel
    Schacht, Ralph
    Winkler, Thomas
    Rzepka, Sven
    Michel, Bernd
    2014 15TH INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME), 2014,