Defect formation and mitigation in Cu/Cu joints formed through transient liquid phase bonding with Cu-Sn nanocomposite interlayer

被引：5
|
作者：
Jiang, H. [1 ]
Robertson, S. [2 ]
Liang, S. [1 ]
Zhou, Z. [2 ]
Zhao, L. [1 ]
Liu, C. [1 ]
机构：
[1] Loughborough Univ, Wolfson Sch Mech Elect & Mfg Engn, Loughborough LE11, England
[2] Loughborough Univ, Loughborough Mat Characterisat Ctr, Dept Mat, Loughborough LE11 3TU, England
来源：
MICROELECTRONICS RELIABILITY | 2022年 / 138卷
基金：
英国工程与自然科学研究理事会;
关键词：
3D IC; Transient liquid phase bonding; Nanocomposite interlayer; Defect formation; Microstructure;
D O I：
10.1016/j.microrel.2022.114681
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Joining based on transient liquid phase bonding (TLPB) has a great prospect However, this process is plagued with its low throughput. In this work, we designed Sn nanocomposite interlayer (Cu-Sn NI) to speed up the TLPB process. Comparing with
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页数：6
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